TV07DZ-23-151PB-LC_Datasheet PDF

 人参与 | 时间:2021-06-20 01:36:38

Au Japon, les choses sont également différentes. Dans les régions à grande concentration démographique, comme Tokyo, des problèmes importants de circulation ont nécessité la création d'un service d'informations sur la circulation routière, appelé VICS. C'est pourquoi les Japonais sont très présents dans le domaine de la navigation et que nous collaborons intensivement avec un partenaire japonais pour des projets de développement.

For example, Xilinx FPGA's LVDS input can accept a maximum 6mA current, if increasing the current of an A/D LVDS output stage from 4.5mA to 6mA, the transmission power is increased from 2mW to 3.6mW per channel, then the timing margin can be improved from 550ps to 650ps with the same speed 492MBPS (41MSPS of 12 bit A/D), a bigger transmitter clock jitter RMS value 50ps, and BER 10-14 .

If A/D designer can specify an input current of a receiver ASIC LVDS interface, then an A/D LVDS current may be further increased to 10mA from a standard LVDS. In that case slew rate will be almost doubled, and rise and fall time will be decreased by roughly two times. The minimum bit time will be decreased or timing margin will get bigger, and the maximum speed limitation will be increased significantly.

TV07DZ-23-151PB-LC_Datasheet PDF

The calculation results shown that a four-channel A/D with a non-standard 10mA LVDS can support a serial interface data rate 768MBPS (64MSPS of 12 bit A/D) with timing margin 400ps and BER 10-14 . In addition, an eight-channel A/D with a non-standard 10mA LVDS will provide a serial interface data rate 652.8MBPS (54.4MSPS of 12 bit A/D) with transmitter clock jitter RMS value 25ps, timing margin 400ps andBER 10-14 .

The drawback is that the non-standard 10mA LVDS maximum swing is +/-1V instead of +/-450mV and the transmitted maximum power consumption is 10mw per channel, but they may still be acceptable in some applications and they are much lower than a 3.3V CMOS output swing.

Multi Gigabit Interface

TV07DZ-23-151PB-LC_Datasheet PDF

HyperTransport Interface HyperTransport interface is a new high-speed, high-performance, chip-to-chip link for integrated circuits. It requires the implementation of physical layer, data link layer, transaction layer, session layer, and protocol layer functions.

Because a CRC is used in its data link layer, a receiver can detect some bit errors, therefore the tolerance of a BER will be larger, and the scaling factor for converting clock jitter RMS to peak-to-peak value will be smaller. On the other hand, the required eye diagram margin will be decreased. Thereby the fast data rate of 1.6Gbps per channel can be achieved with Hypertransport technology.

TV07DZ-23-151PB-LC_Datasheet PDF

RocketIO Interface RocketIO interface is based on MindSpeed's SkyRail technology and implemented in Xilinx FPGA. The RocketIO interface is designed to operate at any data rate in the range of 622Mbps to 3.125Gbps. It supports Fiber Channel, Gigabit Ethernet and Infiniband communications.

Except for all the basic functions of a physical layer and a data link layer has been implemented in the RocketIO interface, it also supports clock correction, channel bonding, 8B/10B code/decode, and embedded clock functions.

Unified designs

Unified hardware and software designs as well as data management are critical for both SoC and SiP. Layout-driven vs. specification-driven flows must be considered. Designers desire both a schematic and layout driven bi-directional interface. Even within a SoC design there may be different libraries. Quality of top-level instantiations can be compromised due to clashing of different versions within the simulators used. Links between IC layout and module layout are needed. Module and IC libraries in the same environment would allow optimization of the IC and system/module design on the fly. Reconfigurable platforms to analyze options based on alternative technologies are key to optimizing the design. Licenses cost money, so choices in tools are continually being made that complicate the design-flow strategy.

For system-in-package design, component synthesis is needed for resistors, capacitors, inductors and transmission lines. The power and ground nets of the standard packages can be extracted from existing full-package design files (if they exist) and compared. However, analyzing the variations due to mirrored imaging of flip-chip stacked die vs. wire-bonded stacked die arrangements may be an early challenge in the design cycle. Spice modeling is traditionally used for specific simulations between inputs and outputs of different die. As the speed requirement for the application increases, more simulations are required to verify timing and performance.

Back-annotation steps are needed from the design of the mechanical inputs and the electrical evaluation back to system level, ensuring that any changes made do not compromise the complete system's proper performance. For this back-annotation step you need appropriate behavioral models for system simulation. They can be obtained either by back annotating parameters or by generating reduced-order models. Next steps are the layouts of the mechanical and electronic parts of the system. Even at this stage changes are taking place, which need to be back annotated to the component level and also to the system level if necessary. For instance, specific capacitances not known prior to layout must be back annotated.

The advantage of this approach is the possibility of performing a special kind of sensitivity analysis, where you can determine certain measures for the influence of each model parameter to each functional parameter, providing insight into which influence is critical for a particular design. Knowledge about these critical influences at an early design phase is essential for keeping recursion loops small.

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