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The uptake for Express comes despite the fact a version of the technology geared for the needs of comms systems died last year. Backers pulled the plug on the Advanced Switching Interconnect (ASI) after it failed to gain traction in comms designs.

The recruiting consultant prescreens all submitted resumes. Those with 'red flags' likely don't get past the initial review. Red flags include a history of job hopping,” a resume that doesn't indicate relevant skills at the right level or a resume so large and dense that it is hard to decipher, says Nordvik.

The resumes showing promise are then given to Nordvik or another company leader for a phone screening session. During the call the company is trying to assess communication skills and the technical expertise.


We also want to see if the person has the drive and passion we want on staff,” says the engineering leader.

Job seekers should be prepared to talk about themselves, as well as the company and its services. My advice to candidates is to be prepared and be knowledgeable about our company so I don't have to waste time on the call relating what a candidate could easily have learned from our website,” says Nordvik. He also hopes to hear the candidate offer up some questions for him as well.

By asking me specific on-topic questions I know the person is interested in who we are and what's happening with the technology,” he explains.


If the job seeker succeeds on the phone interview he or she is asked in for a face to face meeting with three senior engineers. Candidates meet with each engineer for about a half of an hour, with each engineer targeting different topics and asking different questions.

If the interview is progressing well, with good feedback from the first or second engineer, Nordvik will usually meet with the candidate after the third meeting.


I usually do the wrap up and let them know we'll be in touch within 24 hours with a decision,” says Nordvik who then reconvenes with the interview team to discuss how and where the person might be a good fit for the team. If there are remaining questions or concerns, the candidate could be invited back for a second interview.

The company is currently looking to hire at least five engineers this year, which is consistent with its hiring pace in the past few years.

Memory will be among the first devices to deploy through-silicon vias, Stork said. But traditional wire-bonding and current chip-stacking techniques continue to make strides and may nudge out the need for true 3-D packaging. A factor in current packaging technology's favor, he said, is that it is remarkably cheap.”

3-D or bustFor years, the industry has talked about the need for 3-D packaging in applications such as cellular phones, PDAs and other small-form-factor products. Pioneers in the sector are using at least four methods to devise the chip stack: die-to-die, package-to-package, die-to-wafer and wafer-to-wafer.

There are two competing though-silicon via technologies–dry etch and laser–but a more pressing issue is whether to generate the vias in the wafer fab or the packaging house.

Several 3-D packaging and product startups, including Cubic Wafer, Tezzaron, Ziptronix and ZyCube, have emerged and are sampling products, but those offerings are no- where near the mainstream,” said Jim Handy, an analyst with market research firm Objective Analysis (Los Gatos, Calif.). The industry is still doing wire bonding, and there is more interest in package-on-package right now.”

Still, established entities such as Elpida, IBM, IMEC, Samsung and Sematech are working on the technology. Last year, Samsung Electronics developed a 3-D chip-packaging technology based on a proprietary wafer-level stack process (WSP) and through-silicon via interconnect. The company's first 3-D package houses a 16-Gbit memory solution that stacks eight 50-micron, 2-Gbit NAND flash dice and is 0.56 mm in height. WSP has a 15 percent smaller footprint and is 30 percent thinner than an equivalent wire-bonded MCP solution, the company said.

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